Infineon has announced a major expansion of its SDV, software-defined systems (SDX) and Physical AI portfolio.

TI has introduced two new industrial communications products aimed at helping manufacturers simplify connectivity.

Qualcomm once occupied an enviable position, but now appears to have entered a more challenging business environment.

MediaTek has reported double-digit growth in both revenue and profit for the third quarter of 2026, while confirming it has ...

How cloud-hosted FPGAs are transforming hardware evaluation into an instant, zero-install software experience.

Microchip adds EtherCAT and Time-Sensitive Networking (TSN) capabilities to its PolarFire FPGA and SoC platforms.

The IP65 option is available on the larger L and XL versions of the SMART-CASE range, provided the enclosure is specified ...

Movandi has introduced a new 60GHz wireless connectivity platform for AI, broadband and network infrastructure.

The AI race is seen as a contest to build the most advanced processors, but could photonics give Europe the edge?

MIKROE has launched the UNI Hall 3 Click board, a compact add-on module designed to support the development of contactless ...

Marvell Technology has agreed to acquire optical components specialist Lumentum in a deal valued at approximately $115 billion, including debt, as the semiconductor company seeks to strengthen its ...

TDK has introduced the TDK-Lambda EDC series of programmable DC-DC power supplies, targeting applications that are ...